Next Generation Of Connectivity

IC Photonics is at the forefront of transforming data center and AI interconnect solutions with our cutting-edge Co-Packaged Optics (CPO) technology.

By leveraging our proprietary CMOS and pump laser IP, and integrating seamlessly with existing SiPh solutions, we're delivering high-bandwidth, low-power optical I/O that redefines chip-to-chip, blade-to-blade, and rack-to-rack communication. Our seasoned executive team brings unparalleled expertise in Packaging, Analog, RF, DSP, Photonics, and Laser Technologies, ensuring a proven path to semiconductor production and market success.